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                       MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G http://onsemi.com 7 PACKAGE DIMENSIONS AXIAL LEAD CASE 267?05 ISSUE G STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE 1 2 K A K D B DIM MIN MAX MIN MAX MILLIMETERS INCHES A 0.287 0.374 7.30 9.50 B 0.189 0.209 4.80 5.30 D 0.047 0.051 1.20 1.30 K 1.000 --- 25.40 --- NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 267-04 OBSOLETE, NEW STANDARD 267-05. DPAK (SINGLE GAUGE) CASE 369C?01 ISSUE D b D E b3 L3 L4 b2 e 0.005 (0.13) M C c2 A c C Z DIM MIN MAX MIN MAX MILLIMETERS INCHES D 0.235 0.245 5.97 6.22 E 0.250 0.265 6.35 6.73 A 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.030 0.045 0.76 1.14 c 0.018 0.024 0.46 0.61 e 0.090 BSC 2.29 BSC b3 0.180 0.215 4.57 5.46 L4 ??? 0.040 ??? 1.01 L 0.055 0.070 1.40 1.78 L3 0.035 0.050 0.89 1.27 Z 0.155 ??? 3.93 ??? NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI- MENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. 12 3 4 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 mm inches SCALE 3:1 *For additional information on our Pb?Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* H 0.370 0.410 9.40 10.41 A1 0.000 0.005 0.00 0.13 L1 0.108 REF 2.74 REF L2 0.020 BSC 0.51 BSC A1 H DETAIL A C SEATINGPLANE A B L1 L H L2 GAUGEPLANE DETAIL A ROTATED 90 CW |